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Services |
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Home » Services » In House Services |
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| In House Services |
| Our in-house manufacturing group allows us to process customer-supplied wafers, wafers purchased specifically for your needs, or inventory wafers off our shelves. Put our team to work for you in any combination of services needed to satisfy your requirements. |
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| Grinding & Polishing |
| Single and Double Side |
| Wafer Thinning to 50 μm |
| Bare & Circuited Wafers |
| Single and Multiple Stack of Bonded • MEMS Wafers |
| Standard 48-hour, 24 hour and Same Day Turn Time |
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| Special Services |
| Laser Scribing |
| Laser Cut Downs |
| Edge profiling |
| Cleaning |
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| Thin Film Services |
| Wet and Dry Thermal Oxidation • 100Å - up to 300,000Å |
| Metallization |
| Photoresist |
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| Metrology |
| Resistivity & Type |
| Orientation |
| Flatness |
| Thickness |
| Particle Detection |
| Film Thickness |
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| Custom Processing |
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PSG \ BPSG |
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Plasma Nitride |
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Polysilicon |
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Photolithography |
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Epitaxy |
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S.O.G. |
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Metals |
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LPCVD Silicon Nitride |
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Plasma Oxide |
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TEOS Oxide |
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PETEOS |
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LTO |
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