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Home » Services » Laser Cutting & Scribing |
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| Laser Cutting |
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Diameter reduction |
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Special geometry cuts |
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Customer supplied materials |
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Bare & Circuited Wafers |
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Front surface protection guaranteed |
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ESD protection guaranteed |
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Wafer edge grind available after laser cuts |
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| Laser Marking |
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Format: M-12, M13, or customer specific |
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Depth from 4 um (soft laser mark) to 60 um (hard laser mark) |
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Vector or dot matrix |
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