|
|
|
Services |
|
|
 |
Home » Services » Backgrinding & Wafer Thinning |
 |
|
|
|
|
| Backgrinding & Wafer Thinning |
 |
 |
3” through 8” wafers down to 50µm thickness |
|
Tight TTV control (< 1 µm) |
|
Tight wafer-to-wafer thickness control (< 1 µm) |
|
Bare & Circuited Wafers |
|
Front surface protection guaranteed |
|
ESD protection guaranteed |
| |
|
|
| |
|
 |
|
CMP processing of thin film (Oxide, Poly Si, Nitrides) |
|
Wafer stack thinning |
|
Pre-bonding processing |
|
Single and Double Side processing |
|
Foundry service for MEMS Fabs |
|
Quick turnaround on thinning services |
| |
|
|
|
|
|
|
 |
|
 |
|
|
|
|
|
