SQI specializes in high-performance, high-quality, high-concentration, thick epitaxial layers, with particular expertise in SiGe deposition with tight grading controls.
Thin Films
Dry oxide, wet oxide or combined processing for improved dielectric strength 1) Specialty thick oxide growth to over 25 um 2) Thickness: = 5% 3) Uniformity: = 2%
Thermal annealing for defect passivation
Metallization through sputtering
Other specialty films upon request
Precision wafer thinning
Precision
Thin Wafers
Back grinding
SOI Processing
Single-side / double-side
TTV <1um Wafer-to-wafer thickness <1um
Ground thickness below 50um
Grinding of circuited wafers ESD protection
Thinning of bonded SOI stacks Polishing for bonding preparation
Double-side grind Simultaneous double-side polishing Protection of front or back surface as needed.
Laser Services
Cut custom shapes and diameters
Diameter reduction of circuited wafers for processing in domestic fab
Cut multiple wafers from a single substrate
Edge treatment and Stress relief
Specialty formatting or SEMI-standard characters
Soft or hard laser mark
Serial numbers
Check-sum characters
Wafer Recycle
SQI offers wafer recycle services that include….
Sorting to ensure conformance to final specification
