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SQI is the world-wide distributor for Lawrence Semiconductor Research Labs through the joint venture LSQI. LSQI can deposit silicon and silicon-germanium onto essentially any substrate. LSQI specializes in high-performance, high-quality, high-concentration, thick epitaxial layers, with particular expertise in SiGe deposition with tight grading controls. |
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- Dry oxide, wet oxide or combined processing for improved dielectric strength
1) Specialty thick oxide growth to over 25 um
2) Thickness: = 5%
3) Uniformity: = 2%
- Thermal annealing for defect passivation
- Metallization through sputtering
- Other specialty films upon request
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Precision |
TTV <1um Wafer-to-wafer thickness <1um |
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Thin Wafers |
Ground thickness below 50um |
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Back grinding |
Grinding of circuited wafers ESD protection |
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SOI Processing |
Thinning of bonded SOI stacks Polishing for bonding preparation |
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Single-side / double-side |
Double-side grind Simultaneous double-side polishing Protection of front or back surface as needed. |
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- Cut custom shapes and diameters
- Diameter reduction of circuited wafers for processing in domestic fab
- Cut multiple wafers from a single substrate
- Edge treatment and Stress relief
- Specialty formatting or SEMI-standard characters
- Soft or hard laser mark
- Serial numbers
- Check-sum characters
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| SQI offers wafer recycle services that include…. |
- Sorting to ensure conformance to final specification
- Metal and other film removal
- Polishing to prime or test spec
- Laser marking for tracking purposes
- Additional processing as specified
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